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Applied Materials, BE Semiconductor Industries expand EPIC Center cooperation for AI packaging

Applied Materials said on Thursday it will expand its strategic partnership with BE Semiconductor Industries, with BESI joining Applied\'s EPIC Center as an innovation partner. The companies plan to widen cooperation beyond their joint development program launched in 2020 to cover new interconnect structures and applications. They will jointly optimise process and assembly solutions across advanced packaging, from wafer-level hybrid bonding to panel-scale integration, aiming to deliver jointly optimised results to customers earlier.

Telecommunications & Media

20th anniversary iPhone again tipped to use four-sided bending display

Apple is still pursuing a four-sided bending display for its next iPhone Pro, the tech site 9to5Mac reported. The design would curve the screen around all four edges to sharply reduce the visible border and deliver an almost bezel-free front. The model is expected to mark the iPhone’s 20th anniversary next year. The report said Apple may drop some panel-thinning and power-efficiency technologies, citing component cost pressures such as rising memory prices.

AI & Enterprise

KB Kookmin Bank runs generative AI training for executives to write business plans

KB Kookmin Bank conducted hands-on training in generative AI for executives including CEO Lee Hwan-joo (이환주). The bank said it trained executives and division heads to use the generative AI tool Copilot in actual work. The programme was held twice, on Aug. 25 and Sept. 2, and drew about 50 participants. It was designed in-house and had participants draft initial 2027 business plans for their units.