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Industry
ADTechnology wins chiplet design order for U.S. AI datacenter chips
ADTechnology said on Monday it signed a 40 billion won turnkey contract with a U.S. AI fabless company to develop and supply chiplets for a datacenter high-performance computing system-on-chip. The company will handle the full process from design to tape-out and mass production based on Samsung Foundry\'s 4-nanometre process. The project targets an integrated SoC chiplet combining HBM and AI accelerator logic, with tape-out aimed for the fourth quarter of 2026.
Industry
Design houses move from outsourced chip design to AI chip architecture
Design house (DSP) companies that once focused on outsourced semiconductor design are expanding in both contract pricing and funding scale as AI chip mass production becomes harder with foundry steps alone after 2-nanometre nodes. With physical limits nearing, 2.5D and 3D stacking and chiplets are becoming key, making advanced packaging and interconnect new battlegrounds. Firms are shifting toward integrated design platforms and infrastructure architecture partnerships, alongside rising high-value project shares and larger financings.
Industry
ADTechnology to target edge and sovereign CPU design market
ADTechnology said it will shift from a traditional design house model based on customer drawings to proactively proposing AI server chip architectures. CEO Joon-kyu Park said the company will move from a passive approach to an active model of proposing needed architectures and co-developing them with clients. It aims to reach 1.5 trillion won in revenue by 2030 and plans to target demand for ARM-based CPUs for edge servers and sovereign environments.