LG Electronics is moving to target the market by supplying AI data centre cooling facilities as fully pre-fabricated packages. LG Electronics said on Sept. 29 it took part in Data Center World Asia (DCWA) 2026, Asia's largest data centre exhibition that opened in Singapore, and showcased total solutions spanning heat management, power and operations.

The exhibition marked the first public unveiling of the Hydronic Modular solution, which bundles pumps, valves and an emergency buffer tank into a single unit. Hydronic Modular is a pre-fabricated approach that integrates pumps and piping as a finished product inside an ISO-standard container. On site, customers can run the cooling system immediately by connecting the chiller body to the container module, the company said. Until now, delivering chilled water produced by a chiller to a server room required welding and assembling numerous pumps and pipes, taking significant time and cost.

The modular approach is also advantageous for expansion. Demand to build ultra-large AI data centres quickly is growing alongside a surge in AI use. Because customers can add standardized modules as needed, they can adjust investment size in line with their expansion plans. LG Electronics explained that both the build period and the initial investment burden are reduced.

A new chiller product on display was an air-cooled, oil-free inverter turbo chiller. It uses an oil-free compressor with magnetic bearings to reduce friction losses and improve cooling efficiency. It also applies refrigerant free-cooling technology, in which refrigerant condensed by outside air circulates on its own to cool heat without running the compressor, reducing energy use. A fan wall unit (FWU), which supplies cool air into a data centre and exhausts heat, was also shown.

In its liquid-cooling lineup, the centrepiece is the coolant distribution unit (CDU), equipment that distributes cooling water to each server. LG Electronics has CDUs ranging from the 600-kilowatt class to multi-megawatt class, and this time it introduced 1-megawatt and 2.6-megawatt models. Starting with the 600-kilowatt product, the 1-megawatt and 2.6-megawatt products received approval under Nvidia quality standards. The products use a direct-to-chip method that circulates cooling water through cold plates that contact the chips, and they can be used alongside existing air-cooling systems.

LG Electronics is also developing an immersion-cooling solution that directly immerses servers in a special non-conductive cooling fluid. It plans to broaden its portfolio by tying together the full thermal-management cycle from chiller to CDU and cold plate as a Chip-to-Chiller total solution. The exhibition also set up a One LG space. LG Energy Solution introduced a 2170 cylindrical battery for battery backup units, as well as the JF2 DC Link and JP5 UPS battery. LG CNS unveiled a prefabricated modular data centre and an AI factory full-stack service.

Lee Jae-sung (이재성), president of LG Electronics' ES Business Division, said, "We will move forward to become a key partner in the global AI infrastructure market by putting forward cooling total solutions optimized for ultra-large AI data centres."