Mobilint said on Wednesday it signed a memorandum of understanding with POSCO DX to jointly develop industrial AI solutions based on AI semiconductors. The companies plan to combine AI chip technology and on-site operational capabilities to develop and commercialise solutions for manufacturing, robots, logistics and safety. Cooperation includes joint AI hardware development, proof-of-concept projects and technical verification, and building a collaboration framework. They also plan to shift AI infrastructure from GPUs to NPUs to cut costs and improve power efficiency.