Hanwha Semitec has developed a second-generation hybrid bonder and plans to deliver the SHB2 Nano to customers in the first half of this year for performance testing, the company said on Tuesday. The equipment directly bonds chips on copper surfaces and is seen as a next-generation technology for boosting performance and productivity of high-bandwidth memory for AI semiconductors. Hanwha Semitec also aims to strengthen its position in the TC bonder market and is developing a second-generation TC bonder.

Hanwha will separate its defence, shipbuilding, energy and finance operations from its tech and life businesses after its board approved a shareholder spin-off on Jan. 14. The existing company will keep the core industrial businesses, while a new company will hold tech and consumer units. Hanwha expects the move to ease a conglomerate discount and improve decision-making. It also plans to cancel 4.45 million common shares, raise the minimum dividend and buy back remaining old preferred shares for cancellation.