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Industry
Applied Materials, Intel to cooperate on transistor, interconnect and packaging at EPIC Center
Applied Materials and Intel agreed to work together to speed development and commercialization of AI semiconductor manufacturing technologies. The companies will link Applied’s EPIC Center in Silicon Valley with Intel’s R&D campus in Hillsboro, Oregon, to shorten the time from development to commercialization. Cooperation covers next-generation materials, process technologies and device structures for advanced logic nodes, spanning FEOL and BEOL, including interconnect scaling and Foveros-based advanced packaging.
Industry
Applied Materials, BE Semiconductor Industries expand EPIC Center cooperation for AI packaging
Applied Materials said on Thursday it will expand its strategic partnership with BE Semiconductor Industries, with BESI joining Applied\'s EPIC Center as an innovation partner. The companies plan to widen cooperation beyond their joint development program launched in 2020 to cover new interconnect structures and applications. They will jointly optimise process and assembly solutions across advanced packaging, from wafer-level hybrid bonding to panel-scale integration, aiming to deliver jointly optimised results to customers earlier.
Industry
Applied Materials, Kioxia launch joint research on AI memory
Kioxia will join Applied Materials\' EPIC Center, a Silicon Valley research facility, as an innovation partner to work on joint research into next-generation memory technology, the company said on Tuesday. The work will cover four areas, including advanced memory cell and structure formation, multi-chip stacking to raise density within limited form factors, improvements in stacked memory packaging such as interconnect performance, and materials engineering approaches to support high-volume manufacturing.
