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Industry

Applied Materials, SK Hynix to jointly develop next-generation DRAM, HBM

Applied Materials and SK Hynix signed a long-term R&D partnership to develop next-generation DRAM and high bandwidth memory for AI and high-performance computing, the companies said on Tuesday. They plan to build and run the Applied EPIC center in Silicon Valley this year, with SK Hynix joining as a founding partner. The effort will focus on new materials, process integration and advanced packaging, with the center expected to expand to $5 billion.

Industry

Chip equipment makers step up test chip competition as proof demands rise

Semiconductor equipment makers are reinforcing test chip capabilities as chipmakers increasingly require pre-validated solutions for advanced processes. With the cost of halting production lines rising for sub-2-nanometre nodes, chipmakers are reluctant to test new tools and materials on their own fabs. Applied Materials is expanding test chip teams and global R&D infrastructure, including a META Center in New York. Samsung Electronics is also working with key customers on PPA evaluations and test chip collaboration.