AD Technology is moving to target the North American AI infrastructure market with its self-developed 2-nanometre CPU platform. AD Technology said on Thursday it signed a memorandum of understanding in New Jersey with North American semiconductor design specialist Kenyi Technologies to develop a next-generation system-on-chip platform for high-performance computing (HPC).

The cooperation marks the first time AD Technology’s 2-nanometre process-based custom CPU, ADP620, is applied to an actual customer project. Kenyi was founded by former Qualcomm engineers and focuses on AI inference and networking acceleration.

The two companies will jointly develop an edge server solution that integrates ADP620 with Kenyi’s data processing unit (DPU) and Arm-based computing chiplets in a single package. The scope of cooperation covers the entire process, from chiplet-based processor design to interposer design and packaging manufacturing.

The edge server DPU being developed targets the distributed radio access network (DRAN) environment, which currently accounts for about 90 percent of the wireless network market, and the AI-RAN market, described as the next-generation intelligent radio access network. By combining high-performance CPU chiplets with a specialised DPU, the company said the solution is expected to improve power efficiency and scalability compared with existing general-purpose CPU-centred servers, while also lowering manufacturing costs.

AD Technology will lead interposer design for connections between chiplets and overall advanced packaging manufacturing processes. The company said it plans to reduce customers’ development risks through a turnkey approach that includes design services, intellectual property (IP) and outsourced semiconductor assembly and test (OSAT), and to strengthen supply-chain leadership in vertical markets that require high-performance computing such as cloud AI and machine learning.

AD Technology CEO Park Jun-gyu (박준규) said the cooperation was the first case in which ADP620, developed by concentrating the company’s organisation-wide capabilities, had its technical value recognised in the global market. He said the company would further expand strategic partnerships in overseas markets including North America as a “global AI infrastructure architecture partner” that leads the entire process from the early stage of architecture design to final finished-product manufacturing, going beyond being a design house.

Kenyi CEO Vincent Loncke (Vincent Loncke) said AD Technology’s proprietary 2-nanometre HPC CPU platform and expertise in advanced packaging were the most ideal partner conditions to target the next-generation semiconductor market. He said the companies would combine their core technologies to introduce high-performance chiplet solutions that can lead the fast-growing global telco server and edge computing markets.