Samsung Electronics is preparing a two-track strategy of conventional HBM5 and its zHBM concept as it seeks to regain leadership in high-bandwidth memory. The company is shifting to a design that stacks HBM directly on top of AI accelerators, removing the interposer that links logic and memory side-by-side. Samsung targets 230 percent higher bandwidth and 70 percent lower power than HBM4E. Commercialisation will hinge on heat management and wafer hybrid-bonding yields.

South Korea's financial authorities expanded the scope of eased network separation rules for AI use to secondary financial institutions and electronic financial business operators. The number of firms to be selected rises to as many as 15, and eligibility thresholds are lowered. Selected institutions can use external AI and security SaaS after putting alternative controls in place. Industry expectations are mixed, with some firms cautious. Global fintech investment rose to $103.1 billion in the first half, with focus expected to shift to AI and financial infrastructure.